Each AI News, an investor asked on the investor interactive platform: The rapid development of technology has led to the upgrading of a series of electronic products, and electronic systems and equipment are also developing in the direction of integration, miniaturization, efficiency and reliability. The increase in the integration of electronic systems will also lead to an increase in product density, and in turn the heat generated during the official operation of the entire electronic components and system will also increase. As a new green package with high thermal conductivity and good comprehensive performance, ceramic packaging substrates have become the future An important direction for the sustainable development of electronic packaging materials. Does the ceramic packaging materials currently planned and designed by China Ceramics include aluminum nitride ceramic substrates and silicon nitride ceramic substrates? Thanks!
China Ceramics Materials (300285.SZ) stated on the investor interactive platform on June 26 that the company’s powder and substrate research and development capabilities based on aluminum nitride, silicon nitride, and high-end alumina and China Ceramics Saichuang’s ceramics Substrate production capacity, we are actively building a ceramic substrate industry platform, and currently have deployed thin film ceramic substrates, laser optical communication substrates, lidar ceramic substrates, radio frequency and other products.
(Reporter Bi Luming)
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